Machinery update archivos - Page 3 of 3 - Gacem
 

Machinery update

GCE improves its multi-layer department by acquiring an INDUBON PLR that brings many improvements in constructing multi-layers. They include: High precision optical layer to layer registration. Inductive bond technology (InduBond) to ensure better registration. Bonding points resist internal layer movements during hot press cycle. No post-etch punching or post-etch...

GCE incorporates the latest Orbotech automated optical repair innovation that repairs short-circuits in seconds. Much quicker than any existing system, Perfix can offer high-quality repairs of the most advanced PCB designs, thus reducing scraping. Main features: Maximum scrap reduction: Perfect repairs of faults caused by short-circuits and excess copper. Track...

In its ongoing technological development, GCE incorporates a new POSALUX ULTRASPEED 6000-LZ machine to its machining department. Its main features include: Constant long-term precision during machining thanks to the thermal stability guaranteed by a new water cooling system. 5 stations of 24” x 28´5” (609 x 724mm), single...

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