INDUBOND PLR (Layer centering machine)

INDUBOND PLR (Layer centering machine)

GCE improves its multi-layer department by acquiring an INDUBON PLR that brings many improvements in constructing multi-layers. They include:

• High precision optical layer to layer registration.
• Inductive bond technology (InduBond) to ensure better registration.
• Bonding points resist internal layer movements during hot press cycle.
• No post-etch punching or post-etch drilling process is necessary.
• Offers the best registration precision with the 8+4 CCD camera system for the new optical alignment system.
• Inner layer front to back image registration and inner layer geometry shape measurement for quality control and statistic alignment compensation.
• All the accumulated tolerances of the traditional post etch punch and pin lamination tools systems are eliminated.
• Four bonding heads working simultaneously and independent with X/Y movement to place bonding locations
  for fixing the registration prior to lamination in any location of the PCB.
• Bonding locations are loaded directly from Gerber files.
• All laminate materials can be bonded (FR4, HTG FR4, Rogers, Polyamide..).
• Automated process.