Chemical Silver

A 0.20 to 0.3 um chemical silver deposit plus an organic component that delays oxidation and electromigration. Created by immersion. Thickness usually ranges from 0.12 to 0.40 microns.
This finish offers a great number of advantages, including:

– Highly conductive, precious metal
– Great resistance to oxidation
– Flat soldering surface
– Suitable for contacts (keyboards) and wirebonding
– Long storage life: minimum of over 1 year
– Supports 6 blasts in the soldering or wave furnace
– Excellent soldability
– Soldering can be completed in 2 months
– The solder bond is created with copper and tin
– Suitable for press-fit connectors
– This finish can be reprocessed by the circuit manufacturer
– Simple circuit application process
– Low relative cost
– Solder can get wet
– Multiple reflows
– Immersion finish
– Suitable for fine pitch/BGA/small components
– Can be reworked
– Average expiry time if well packaged