Lead-Free Tin (HAL LF)

Same as the previous finish but lead-free
In this process we try to introduce the circuit in a bath of molten tin. Deposition with a thickness of 2μ to 40μ or more.

This finish offers a great number of advantages, including:

– Low relative cost
– Cu/Sn bond
– Reprocessable
– Long useful life
– Excellent solderability for over one year
– Relatively economical
– Withstands long processing periods
– Well known in the industry
– Expiry over 12 months
– Withstands multiple soldering cycles