Chemical Tin

A 0.6 to 1.2 chemical deposit of pure tin applied to copper. Thickness usually ranges from 1 to 40 microns by immersion.

This finish offers a great number of advantages, including:

– Immersion finish
– Flat soldering surface
– Good solderability
– Ideal for inserting press-fit connectors
– Scratch resistant
– The circuit manufacturer can reprocess this finish if necessary
– The solder bond is created with copper and tin
– Low relative cost
– Solder wettability
– Reprocessable
– Cu/Sn bond
– Suitable for fine pitch/BGA/small components
– Good solderability after multiple soldering cycles