PEELABLE INK
PEELABLE INK
Peelable ink is designed to cover parts of the printed circuit we don’t want to get wet during the soldering process. It should also be easy to then take off without leaving any traces. The product and the process are suitable for all kinds of “high temperature” lead-free assemblies, from conventional wave to multiple reflows:
| Application parameters | ||
|---|---|---|
| Name | Estándar1 | Especiales2 |
| Ink layer thickness | 300μ | 300μ |
| Minimum allowance | 0.50 mm | 0.30 mm |
| Distance to pad | 1.00 mm | 0.80 mm |
| Distance to contour | 1.00 mm | 0.80 mm |
| Maximum hole to cover | 1.30 mm | 1.50 mm |