PEELABLE INK

PEELABLE INK

Peelable ink is designed to cover parts of the printed circuit we don’t want to get wet during the soldering process. It should also be easy to then take off without leaving any traces. The product and the process are suitable for all kinds of “high temperature” lead-free assemblies, from conventional wave to multiple reflows:

 

 

Application parameters
Name Estándar1 Especiales2
Ink layer thickness 300μ 300μ
Minimum allowance 0.50 mm 0.30 mm
Distance to pad 1.00 mm 0.80 mm
Distance to contour 1.00 mm 0.80 mm
Maximum hole to cover 1.30 mm 1.50 mm