ORGANIC PROTECTORS (OSP)

A very thin organic layer (0.1μ / 0.6μ) over the copper pads. Colourless. Normally used in consumer electronics.

This finish offers a great number of advantages, including:

– Flat soldering surface
– Low cost
– Simple application process
– Reprocessable
– The solder bond is created with copper and tin
– Suitable for fine pitch/BGA/small components
– Clean and environmentally friendly process